Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales

Fabrication

von Jianfeng Luo

Taschenbuch

EAN=ISBN-13: 978-3-642-06115-8

ISBN-10: 3-642-06115-X

Springer Berlin Heidelberg · 2010
Siehe auch:
2004Gebundene AusgabeIntegrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales