Pick-up Process Analysis of a Die Bonder: With Dynamic Computer Simulation and Taguchi Method

Analysis

von: Yeong-Jyh Lin · Sheng-Jye Hwang

Taschenbuch

EAN=ISBN-13: 978-3-639-00034-4

ISBN-10: 3-639-00034-X

VDM Verlag Dr. Müller · 2008